Alphane Moon@lemmy.worldM to Hardware@lemmy.worldEnglish · 6 days agoBoiling Water Meets Microchips: The 3D Cooling Breakthrough That’s 7x Fasterscitechdaily.comexternal-linkmessage-square4fedilinkarrow-up133arrow-down10
arrow-up133arrow-down1external-linkBoiling Water Meets Microchips: The 3D Cooling Breakthrough That’s 7x Fasterscitechdaily.comAlphane Moon@lemmy.worldM to Hardware@lemmy.worldEnglish · 6 days agomessage-square4fedilink
minus-squareRobin@lemmy.worldlinkfedilinkEnglisharrow-up6·6 days agoSo this is like a vapor chamber but on chip package level?
So this is like a vapor chamber but on chip package level?